Packaging Engineer |
2009-05-06 |
Company |
TRUMPF PHOTONICS: Cranbury, NJ |
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Your position |
This position is responsible for set up, control and maintenance of production die bonding and packaging processes. Knowledge of hard soldering, metallurgy, bonding surface chemistry, and characterization techniques for equipment used to mount high power diode laser arrays is required. The individual will be required to set up and maintenance of manual, semi automated and automated die bonding, soldering & packaging processes according to process. Set up, control documentation, maintenance and optimization of production equipment in cooperation with development, using Statistical Process Control (SPC). Assurance of high product performance, output and quality is a key part to the position. Participate in process development, improvement and support incoming good inspection. Also you will train, provide guidance and technical supervision of production technicians. |
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Are you |
Individual must have at least 3 years industrial experience as a semiconductor/diode laser packaging engineer. A good background of metallurgy and statistical process control will be an advantage. Semiconductor background is required. Design for manufacturing proficiency is a must. Masters Degree in Material Science or Mechanical Design Engineering |
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Interested? |
Then send your detailed application with supporting documents to the following address: |
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TRUMPF Inc
Human Resources
111 Hyde Road
Farmington, CT 06032
Fax: (860) 255-6428
or send an e-mail to:
humanresources@us.trumpf.com |
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Process Engineer- Devices |
2009-05-06 |
Company |
TRUMPF Photonics: Cranbury, NJ |
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Your position |
The Process Engineer will be responsible to sustain and improve existing processes for fabricating high power GaAs/AIGaAs high power laser devices and support development of new processes for next generation devices. Duties will include day-to-day process sustaining, continuous improvement, and support of development team including some maintenance activities and possible support of second shift operations. The candidate should work independently with minimal supervision and as a member of a team for larger projects. Should have excellent problem solving skills and have an analytical approach to tasks. The individual must be able to communicate (written and verbal) results effectively, prioritize and accomplish tasks on time and summarize and draw appropriate conclusions from data gathered. SPC, DOE, six sigma and 5S are a plus. Candidates must have experience in automatic pick and place operations and the following processes: GaAs Scribe and Break for laser facets and die separation; die pick and place and stacking for laser facet AR/HR coatings, and die level visual inspection. |
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Are you |
Individual must have at least 3 years hands on experience in a diode laser manufacturing environment. B.S or M.S. in Engineering. |
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Interested? |
Then send your detailed application with supporting documents to the following address: |
|
|
TRUMPF Inc
Human Resources
111 Hyde Road
Farmington, CT 06032
Fax: (860) 255-6428
or send an e-mail to:
humanresources@us.trumpf.com |
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