The laser can handle a variety of cutting tasks. They range from precisely cut micrometer joints in paper-thin semiconductor chips to high quality cuts in 1.25 inch thick steel. In laser drilling, the laser beam creates very small to large sized holes without contact in metals, plastics paper and stone.
Where the focused laser beam strikes the workpiece, it heats the material so much that it melts or even vaporizes. Once it has completely penetrated the workpiece, the cutting process can start. The laser beam moves along the part contour, melting the material as it goes. Typically, a stream of gas blows the melted material downwards, out of the cut. The gap is barely wider than the focused laser beam itself.
In laser drilling, a short laser pulse melts and vaporizes the material with a high power density. The resulting high pressure drives the molten material out of the hole.